스핀 에처 ( Spin etcher), Developing and Etching Appliance Series for R & D

 

JModel JS2E-200

     

 온도 콘트롤, 배수 관리 및 기타 사양을 추가할 수 있습니다.

좌측 사진은 테프론 및 PVC 재질의 몸체입니다.

 

사양

샘플 사이즈:  직경 2인치~8인치

산 특성: 산 및 알칼리 타입

선택사양: 2~4 drain,  chemical nozzle 등

전력:  AC 220V

CDA: 0.5 MPa 이상

DIW: 0.2 MPa 이상

 

 

 

본 스핀 프로세서는 고객의 요구에 맞추어 개조될 수 있습니다.

 

 


 

Spin etcher, Model JS2E-400

온도 콘트롤, 배수 관리 및 기타 사양을 추가할 수 있습니다.

좌측 사진은 테프론 및 PVC 재질의 몸체입니다.

 

사양

샘플 사이즈:  직경 2인치~12인치

산 특성: 산 및 알칼리 타입

선택사양: swing nozzle,  chemical nozzle, rinse 등

전력:  AC 220V

CDA: 0.5 MPa 이상

DIW: 0.2 MPa 이상

 

 

 

본 스핀 프로세서는 고객의 요구에 맞추어 개조될 수 있습니다.



Introduction of developing appliances
    AD-1200
    - Developing Appliance with Swing Nozzle Applicable to Spray and Puddle Development -
       Features
    • High performance, low cost, and compact desktop type
    • Programmable puddle development
    • Substrate size; Φ25.4mm(1inch) to Φ152.4mm(6inch)
    • Simple, programmable LCD control panel
    • Built-in chemical-liquid-compression-pump (Unnecessary to prepare a pressure tank)
    Size: 550Wx400Dx440H(mm)/ 740H?while the cover is open.

    AD-3000
    - Developing Appliance with Twin Swing Nozzles Applicable to Spray and Puddle Development -
    Features
    • Twin swing nozzle spray applicable to development of large-sized substrates
    • Substrate size;?Φ25.4mm(1inch) to Φ304.8mm(12inch)
    • Programmable puddle development
    • Simple, programmable LCD control panel
    • Stable rotation, less than 0.1% error
    • The maximum rotation frequency: 3,000rpm
      Emergency stop button is functional
    • Chemical liquid supplied by pressure tank
    • Up to three separated transfer channels can be optionally installed for different chemical liquid use.
    The maximum substrate size; Φ300mm or square 200mm
    Size: 720Wx520Dx500H(mm)/ 910H while the cover is open.

    These appliances are applicable to many type of substrates, such as silicone, compound semiconductor, glass, and ceramic.
    We provide options such as chemical liquid thermal control system.
    We also provide developing appliances for large-sized substrates and automatic appliances.



Introduction of Etching Appliances
    ED-1200
    - Spray Etching Appliance with Swing Nozzle -
       Features
    • High performance, low cost, and compact desktop type
    • Substrate size; Φ25.4mm(1inch) to Φ152.4mm(6inch)
    • In consideration of chemical resistance, polyvinyl chloride is used for parts moistened with chemical liquid.
    • Continual processing with etching, rinsing, and drying
    • Built-in chemical-liquid-compression-pump (Unnecessary to prepare a pressure tank)
    • Simple, programmable LCD control panel
    Size: 550Wx400Dx440H(mm)/ 740H?while the cover is open.

    ED-3000
    - Spray Etching Appliance with Twin Swing Nozzles -
    Features
    • Twin swing nozzle spray applicable to development of large-sized substrates
    • Substrate size;?Φ25.4mm(1inch) to Φ304.8mm(12inch)
    • In consideration of chemical resistance, polyvinyl chloride is used for parts moistened with chemical liquid.
    • Continual processing with etching, rinsing, and drying
    • Simple, programmable LCD control panel
    • Chemical liquid supplied with compressed air tank
    • Up to three separated transfer channels can be optionally installed for different chemical liquid use.
    The maximum substrate size; Φ300mm or square 200mm
    Size: 720Wx520Dx500H(mm)/ 910H while the cover is open.

    ED-3000T
    - Spray Etching Appliance with Teflon Coated Chamber -
    Features
    • Twin swing nozzle spray applicable to development of large-sized substrates
    • Substrate size;?Φ25.4mm(1inch) to Φ304.8mm(12inch)
    • The Teflon Coated chamber, excellent in chemical resistance, is adopted
    • Continual processing with etching, rinsing, and drying
    • Simple, programmable LCD control panel
    • Chemical liquid supplied with compressed air tank
    • Up to three separated transfer channels can be optionally installed for different chemical liquid use.
    The maximum substrate size; Φ300mm or square 200mm
    Size: 720Wx520Dx500H(mm)/ 910H while the cover is open.

    NE-7000
    - Small Type Etching Appliance -
    Features
    • Program input and process setup through a LCD control panel
    • Movable or fixed nozzle is selectable.
    • The Teflon Coated chamber, excellent in chemical resistance, is adopted.
    • Continual processing with etching, rinsing, and drying
    • Up to three separated transfer channels can be optionally installed for different chemical liquid use.
    The maximum substrate size; Φ200mm or square 150mm
    Size: 420Wx420Dx740H (mm)

    These appliances are applicable to many type of substrates, such as silicone, compound semiconductor, glass, and ceramic.
    We provide options such as chemical liquid thermal control system.
    We also provide etching appliances for large-sized substrates and automatic appliances.



Introduction of a High Pressure Mask Washing Appliance
    HK-3000
    - Mask Washing Appliance with High Pressure Swing Nozzle -
       Features
    • Swing nozzle spray with high pressure is adopted. (Compressed air of plunger pump; 1.5 to 15 Mpa)
    • Applicable to 63.5mm(2.5inch) to 177.8mm(7inch) masks
    • Programmable rotation frequency; 0 to 3,000rpm
    • A 500W lamp is used for infrared ray drying
    • Simple, programmable LCD control panel

     

     

    경기도 안양시 동안구 호계 1동 555-9, 안양 유통상가 24동 307호, 우) 431-080

    Tel 031-479-1458~9
    Fax 031-479-1457
    mobbydick@korea.com